We publish in both physical sciences and computer science venues.

For physical sciences, we publish Nature, Science Advances, Advanced Materials, Advanced Materials Technologies, etc. We present in SES, MRS, IROS, ICRA, GRC, APS, etc.

In computer science, human-computer interaction, the top venues (~ 20% acceptance rates) include the ACM CHI, UIST, DIS, UbiComp, etc.

Thermorph: Democratizing 4D Printing of Self-Folding Materials and Interfaces

Thermorph: Democratizing 4D Printing of Self-Folding Materials and Interfaces

Byoungkwon An*, Ye Tao*, Jianzhe Gu, Tingyu Cheng, Xiang 'Anthony' Chen, Xiaoxiao Zhang, Wei Zhao, Youngwook Do, Shigeo Takahashi, Hsiang-Yun Wu, Teng Zhang✉, Lining Yao✉ (* Contributed Equally). The ACM CHI Conference on Human Factors in Computing Systems (CHI) 2018 PDF | DOI

Exhibitions: Ars Electronica 2018
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