Silver Tape: Inkjet-Printed Circuits Peeled-and-Transferred on Versatile Substrates

Tingyu Cheng*, Koya Narumi*, Youngwook Do, Yang Zhang, Tung D. Ta, Takuya Sasatani, Eric Markvicka, Yoshiiro Kawahara, Lining Yao, Greogory D. Abowd, and Hyunjoo Oh. ACM journal on Interactive, Mobile, Wearable and Ubiquitous Technologies. (IMWUT).

* contributed equally. 2020. PDF | DOI | Video | Presentation

We propose Silver Stickers, simple yet novel fabrication technique to transfer inkjet printed silver traces from paper onto versatile sticky substrates, without time-space- consuming processes like screen printing and heat sintering. This allows users to exploit unique properties of selective sticky substrates: high flexibility (e.g., Scotch tape), transparency (e.g., PDMS elastomer), heat durability (e.g., Kapton polyimide tape), water solubility (e.g., wave solder tape), and so on.

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Material Characterization and Precise Finite Element Analysis of Fiber Reinforced Thermoplastic Composites for 4D Printing

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Hybrid IGA-FEA of Fiber Reinforced Thermoplastic Composites for Forward Design of AI-Enabled 4D Printing